SK to build next-generation HBM facility in the United States by 2029
SK plans to produce high-bandwidth memory at a next-generation fabrication plant on US soil by 2029. The headline indicates a major semiconductor manufacturing investment.
By DoomRadar · Published on DoomRadar .
Why it matters
Could strengthen US semiconductor capacity and affect global advanced-memory supply chains.
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- SK's next-gen fab to build HBM on US soil by 2029 ↗english.hani.co.kr · Recorded source date: Aug 28, 2026, 12:17 PM UTC
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