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TSMC plans to double CoWoS capacity by 2028

TSMC reportedly plans to double its CoWoS advanced-packaging capacity by 2028.

By DoomRadar · Published on DoomRadar .

Why it matters

The expansion could affect the supply of advanced chips and the pace of artificial-intelligence infrastructure growth.

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  1. TSMC Aktie: CoWoS-Kapazität bis 2028 verdoppelt ↗stock-world.de · Recorded source date: Sep 13, 2026, 1:17 PM UTC

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