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Taiwan and Lithuania sign advanced semiconductor packaging pact

Taiwan and Lithuania signed an agreement on advanced packaging for next-generation chips, with panelists highlighting Nordic research and development expertise.

By DoomRadar · Published on DoomRadar .

Why it matters

The partnership may strengthen resilient semiconductor supply chains amid strategic technology competition.

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  1. Taiwan, Lithuania sign pact on advanced packaging for next-gen chips ↗focustaiwan.tw · Recorded source date: Sep 4, 2026, 10:02 AM UTC

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